您的当前位置:首页正文

Miniaturized small memory card structure

2020-02-21 来源:个人技术集锦
专利内容由知识产权出版社提供

专利名称:Miniaturized small memory card structure发明人:Chung Hsien Hsin申请号:US10683835申请日:20031009

公开号:US20050077620A1公开日:20050414

专利附图:

摘要:A miniaturized small memory card includes a substrate, at least one uppermemory chip, at least the lower memory chip, one upper glue layer, and one lower gluelayer, the substrate is formed with an upper surface and a lower surface, the uppersurface is formed with a plurality of connected points, the lower surface is formed with a

frame to cause a cavity, which formed a plurality of connected points, formed betweenthe frame and the substrate, the frame is formed with a plurality of golden fingers, thegolden fingers are electrically connected to an electric device, the upper memory chip,which is mounted on the upper surface of the substrate, electrically connected to theplurality of connected points of the upper surface, the lower memory chip, which ismounted on the cavity of the lower surface of the substrate, electrically connected to aplurality of connected points of the lower surface, the upper glue layer encapsulated theupper surface of the substrate, so that at least one upper memory chip will be packaged,the lower glue layer encapsulated the lower surface of the substrate, so that at least onelower memory chip will be packaged.

申请人:Chung Hsien Hsin

地址:Hsinchu Hsien TW

国籍:TW

更多信息请下载全文后查看

因篇幅问题不能全部显示,请点此查看更多更全内容

Top